Millimeter-wave Integrated Systems Laboratory

Research Interest

[IC Group - RF/mmW/Sub-THz ICs and Imaging Systems]

Research on high-frequency CMOS integrated circuits operating at RF, millimeter-wave, and sub-terahertz bands. Focus areas include low-noise amplifiers, transceivers, and scalable detector arrays for high-resolution imaging applications.

• Design of CMOS Analog and RF/mmW/sub-THz Transmitters and Receivers for Wireless and Sensing Applications

• RF and mmWave Circuit Design for Emerging Applications: 5G/6G, Remote Sensing, and Quantum Read-out Interface

• RF/mmW Sub-Circuit Designs: VCOs, LNAs, PAs, Mixers, Phase Shifters, Detectors, SWs, Power Combiners/Dividers

​​

[AI-Radar Group] Smart Radar Sensors for Vital Signal and Object Detection

Development of miniaturized radar sensors using CW/FSK/FMCW waveforms, with real-time signal processing and AI-based analytics for non-contact vital sign monitoring and object recognition.

• Miniaturized Radar Sensor Development using CW, FSK, and FMCW Technologies for IoT and Healthcare Applications

• Real-time Vital Signal Detection using Radar Sensors and Signal Processing Techniques​

• AI-driven Signal Processing for Spatial Intelligence using Radar Technologies

​

[Adv. Package Group] Next-Generation 3-D Packaging Technologies

Investigation of advanced packaging and interconnection techniques for high-frequency ICs, including antenna-in-package/on-chip integration, glass interposer platforms, and circuit-EM co-design for performance optimization.

• Design and Optimization of Package and Interconnection for RF to Millimeter-wave Applications

• Development of a Scalable Circuit-Based Modeling Framework for Circuit-EM Co-Design of RF/mmWave Modules

• Design and Integration of Antenna-on-chip and Antenna-in-package on Glass Interposer for mmWave Applications